Material technology for advanced electronics專注先進電子材料的樹脂技術
The company has built over a decade of experience in hydrocarbon resins, high-temperature resins and adhesives. With deep roots in the Chinese supply chain, we specialise in high-temperature thermoplastic and thermosetting engineering plastics, monomer molecules and additives, and have pursued a strategic focus on the high-speed PCB resin market since 2016.本公司累積十餘年碳氫樹脂、耐高溫樹脂與膠黏劑技術經驗，深耕中國供應鏈，長期專注於耐高溫熱塑性與熱固性工程塑料、單體分子及助劑領域，並自 2016 年起戰略布局高速 PCB 用樹脂市場。
- R&D Collaboration研發協作Long-term partnerships with research institutes and manufacturing partners for resin and formulation development.與科研單位及生產單位建立長期合作，共同開展樹脂與配方的研發工作。
- Products & Solutions產品與方案High-frequency, high-speed resin materials and additives for AI computing and next-generation communications, with customised high-performance solutions.因應 AI 算力與次世代通信需求，提供高頻高速樹脂材料及助劑，並按客戶需求訂製高性能材料解決方案。
- Bridging China and the World中外橋樑Bringing advanced overseas materials into the Chinese market while helping high-quality Chinese materials reach international customers, and benchmarking against the demanding standards of leading international customers to help Chinese suppliers advance.既將海外先進材料引入中國市場，也推動中國本土優質材料走向國際；並持續對標國際一流客戶的嚴苛標準，助力中國供應商提升產品性能與品質管理水平。
Products & Services產品與服務
Five product lines covering crosslinkers, oligomers, reactive PPO and formulation additives for high-speed copper clad laminates.五條產品線，涵蓋交聯劑、低聚物、反應性聚苯醚與配方助劑，服務高速覆銅板應用。
BVPE ResinBVPE 樹脂
Functional crosslinker for free-radical curing systems. Ultra-low Df for M8-class high-speed laminates.自由基固化體系的功能性交聯劑。超低 Df，契合 M8 級高速覆銅板需求。
View full technical brief查看完整技術簡介 →BVF ResinBVF 樹脂
New low-dielectric crosslinker with lower CTE, higher Tg and markedly improved solubility.新型低介電交聯劑。更低 CTE、更高 Tg，溶解性顯著改善。
DVB CopolymerDVB 共聚物
Multifunctional vinyl polyphenyl oligomer. Very low Df and CTE, broadly compatible with unsaturated monomers.多功能乙烯基聚苯基低聚物。極低 Df 與 CTE，與多類不飽和單體高度相容。
PPO (Polyphenylene Oxide) Resin聚苯醚 PPO 樹脂
Reactive low-molecular-weight PPO. Ultra-low Dk/Df for 5G and AI accelerator boards.反應性低分子量聚苯醚。超低 Dk / Df，面向 5G 與 AI 加速卡應用。
Other Additives其他助劑
Silane coupling agents, toughening agents, flame retardants, levelling agents and more.矽烷偶聯劑、增韌劑、阻燃劑、流平劑等配套助劑。
Latest News新聞動態
Company updates and technical notes on resin materials for high-speed electronics.公司動態與高速電子用樹脂材料的技術分享。
Company updates and technical notes will be published here. Please check back soon.公司動態與技術分享將在此陸續發布，敬請留意。