BVPE ResinBVPE 樹脂
1,2-Bis(4-vinylphenyl)ethane — a divinyl crosslinking monomer for high-speed copper clad laminates1,2-雙(4-乙烯基苯基)乙烷 — 高速覆銅板用二乙烯基交聯單體
Molecular structure分子結構
Product specifications產品規格
Product positioning產品定位
BVPE is a divinyl aromatic crosslinking monomer for high-speed copper clad laminates (CCL) and low-dielectric resin systems. Two p-vinylphenyl groups are joined symmetrically through a flexible ethane bridge, giving a pure hydrocarbon structure with no polar groups. Free-radical addition crosslinking then builds a three-dimensional network that is low in polarisation and low in moisture uptake.BVPE 為面向高速覆銅板（CCL）與低介電樹脂體系的二乙烯基芳香烴交聯單體。兩個對乙烯基苯基經柔性乙烷橋對稱連接，構成不含極性基團的純烴結構；經自由基加成交聯後，形成低極化、低吸濕的三維網絡。
Its value lies in extremely low dielectric loss combined with a well-ordered crosslink network. It is compatible with polyphenylene oxide (PPO) and other hydrocarbon resins, so it can serve as a base crosslinking component directly within an existing high-speed CCL formulation. Typical development targets include 5G base stations, millimetre-wave radar and AI server boards.其價值在於介電損耗極低、交聯網絡規整，並與聚苯醚（PPO）及各類烴類樹脂相容良好，可作為基礎交聯組分直接嵌入現有高速覆銅板配方體系。典型開發方向包括 5G 基站、毫米波雷達與 AI 伺服器用板。
Key benefits核心優勢
Ultra-low dielectric loss超低介電損耗
The molecule carries no polar groups, so dipolar polarisation and relaxation loss are minimal; the self-polymerised cast resin shows a Df of 0.08%. Introduced into hydrocarbon systems as a multifunctional styrenic compound, laminates reach a Df of 0.0011–0.0013 at 10 GHz in published patent examples.分子不含極性基團，偶極極化與鬆弛損耗極低；自聚合澆鑄體 Df 為 0.08%。作為多官能度苯乙烯化合物加入烴類體系後，公開專利實施例中 10 GHz 下覆銅板 Df 可達 0.0011～0.0013。
High Tg together with low CTE高 Tg 兼具低 CTE
The cured network is built mainly on rigid benzene rings, giving a DMA glass transition temperature of 225–252 °C and a Z-axis CTE of 1.87–2.35%. Both help lower internal stress and reduce the risk of delamination in multilayer boards.固化網絡以剛性苯環為主體，DMA 測試 Tg 達 225～252 ℃，Z 軸 CTE 為 1.87%～2.35%；兩者均有助降低多層板內應力、減少壓合分層風險。
Heat resistance and flame retardancy耐熱與阻燃
T288 (delamination time at 288 °C) exceeds 60 minutes, with no blistering after three 10-second solder dips; flame retardancy reaches UL94 V-0.288 ℃ 分層時間 T288 大於 60 分鐘，浸錫 10 秒 ×3 次未爆板；阻燃等級達 UL94 V-0。
Formulation compatibility配方相容性
Compatible with hydrocarbon resins such as PPO (SA9000, OPE-2st 2200), SEBS and SBS, allowing BVPE to enter an existing formulation as an equal-weight replacement component.與 PPO（SA9000、OPE-2st 2200）、SEBS、SBS 等烴類樹脂相容良好，可作為等量替換組分切入現有配方。
Reference performance參考性能數據
| System體系 | BVPE (phr)BVPE（質量份） | Df @10 GHzDf @10 GHz | Dk @10 GHzDk @10 GHz | Tg (°C)Tg（℃） | Z-CTE (%)Z-CTE（%） | T288 (min)T288（min） | UL94UL94 |
|---|---|---|---|---|---|---|---|
| All-hydrocarbon — SBS-A / BVPE全烴體系 — SBS-A／BVPE | 54 | 0.00112 | 3.25 | 225 | 2.35 | >60 | V-0 |
| All-hydrocarbon — SBS-B / BVPE全烴體系 — SBS-B／BVPE | 63 | 0.00115 | 3.24 | 241 | 1.87 | >60 | V-0 |
| All-hydrocarbon — SBS-A / BVPE (high Tg)全烴體系 — SBS-A／BVPE（高 Tg） | 72 | 0.00123 | 3.23 | 252 | 2.01 | >60 | V-0 |
| Semi-hydrocarbon, halogen-free — PPO / BVPE半烴體系・無鹵 — PPO／BVPE | 10 | 0.00137 | 3.12 | 204 | 2.76 | >120 | V-0 |
| Semi-hydrocarbon, halogen-free — PPO / BVPE (lowest Dk)半烴體系・無鹵 — PPO／BVPE（Dk 最低） | 10 | 0.00142 | 3.05 | 203 | 3.09 | >120 | V-0 |
The performance figures above are taken from published patent examples and supplier documentation. Test conditions and batches differ, and the two formulation routes are not directly comparable. They are provided as a selection reference only and are not a guaranteed specification of our products on a customer production line. Please validate with a pilot trial under consistent test conditions before adoption. The self-polymerised cast Df of 0.08% is a reference value for the pure resin and is not comparable with laminate-level Df values, which are about two orders of magnitude lower.以上性能數據取自公開專利實施例與供應商資料，測試條件與批次各異，兩類配方路線亦不可直接互比；僅供選型參考，並非本公司產品在客戶產線的保證值。導入前建議以一致測試條件作小樣驗證。自聚合澆鑄體 Df 0.08% 屬純樹脂參考值，與覆銅板體系的 Df 相差約兩個數量級，不可直接比較。
Typical formulation routes典型配方路線
All-hydrocarbon: unsaturated triblock copolymer + BVPE全烴體系：不飽和三元嵌段共聚物 + BVPE
BVPE is used at roughly 54–72 phr and is the main contributor to the crosslink network. A dual initiator system (low temperature plus high temperature) controls the two-stage cure of prepreg and press. In the published comparison, removing BVPE altogether degraded Df from 0.00118 to 0.00163, Tg from 238 °C to 185 °C, and T288 from over 60 minutes to 18 minutes.BVPE 用量約 54～72 質量份，是交聯網絡的主要貢獻者；須以低溫＋高溫雙引發劑體系控制預浸與壓合兩級交聯。公開專利對比顯示，體系完全不含 BVPE 時，Df 由 0.00118 劣化至 0.00163、Tg 由 238 ℃ 降至 185 ℃、T288 由大於 60 分鐘降至 18 分鐘。
Semi-hydrocarbon: PPO / OPE base resin + BVPE半烴體系：PPO／OPE 主樹脂 + BVPE
BVPE is used at around 10 phr, with the PPO/OPE base resin carrying the bulk of Tg and heat resistance. This route targets halogen-free, low-dielectric laminates with good resistance to thermal-oxidative ageing, such as 77 GHz millimetre-wave radar substrates.BVPE 用量約 10 質量份，由 PPO／OPE 主樹脂承擔主體 Tg 與耐熱性。該路線面向無鹵、低介電且耐熱老化要求較高的應用，例如 77 GHz 毫米波雷達基板。
Processing and formulation notes加工與配方要點
- A dual initiator system is essential雙引發劑不可或缺A low-temperature initiator works in the prepreg stage to limit resin flow, while a high-temperature initiator completes the cure during pressing. With a single high-temperature initiator only, resin flow becomes excessive and appearance suffers.低溫引發劑在預浸階段抑制流膠，高溫引發劑在壓合階段完成交聯。僅使用單一高溫引發劑時，樹脂流膠過大、外觀不良。
- Solubility溶解度Toluene solubility at 25 °C is about 19 wt%, which limits the preparation of high-solids varnish; the solvent system or the dissolution temperature needs to be adjusted.25 ℃ 甲苯溶解度約 19 wt%，高固含膠液配製受到限制，需調整溶劑體系或提高溶解溫度。
- Temperature profile溫程控制The flexible ethane bridge and the relatively low molecular weight (234) carry a risk of volatilisation or thermal degradation at high temperature, so the temperature profile during pressing and post-cure needs to be controlled.柔性乙烷橋與較低分子量（234）在高溫下存在揮發／熱劣化風險，壓合與後固化階段需控制溫程。
- Low-dielectric ancillaries配套材料須低介電Fillers, glass fabric and flame retardants should all be low-dielectric, low-water-uptake grades. Otherwise they mask the low Df advantage of the resin itself.填料、玻纖布與阻燃劑均應選用低介電、低吸水品種，否則會淹沒樹脂本身的低 Df 優勢。
Companion and upgrade options配套與升級
Where further improvement is needed on the same platform, p-BVF is the next-generation option: a rigid fluorene core replaces the flexible ethane bridge, raising toluene solubility at 25 °C to about 48 wt%, increasing molecular weight by roughly 70% with far lower volatility at high temperature, and reducing the self-polymerised cast Df by a further ~25%. See BVF Resin for details.若需在同一平台上進一步提升，可評估下一代的 p-BVF 方案：以剛性芴核替代柔性乙烷橋，25 ℃ 甲苯溶解度提升至約 48 wt%，分子量提高約 70% 且高溫揮發大幅降低，自聚合澆鑄體 Df 較 BVPE 再低約 25%。詳見「BVF 樹脂」。
Sources資料來源
- CN114106267A and CN114196189A, published patent applications.公開專利 CN114106267A、CN114196189A。
- BVPE and p-BVF Product Brief, V1.0, 珠海固瑞泰複合材料有限公司, 2026-09-10.《BVPE 與 p-BVF 產品簡介》V1.0，珠海固瑞泰複合材料有限公司，2026-09-10。
Need samples, a data sheet, a reference price or a formulation discussion?需要樣品、技術資料、參考價格或配方討論？
Request for Information索取資料