Products & Services產品與服務
Five product lines for high-speed copper clad laminate applications.五條產品線，面向高速覆銅板應用。
BVPE ResinBVPE 樹脂
Functional crosslinker for free-radical curing自由基固化體系功能性交聯劑
A functional crosslinker for free-radical curing systems. It shows excellent compatibility with conventional peroxide initiators and efficiently crosslinks unsaturated hydrocarbons while lowering curing temperature. Dielectric, thermal and mechanical performance are all markedly improved. Low water uptake, high reactivity, low viscosity and high Tg together deliver ultra-low Df, making it a strong fit for M8-class high-speed copper clad laminates (CCL).用於自由基固化體系的功能性交聯劑。與常規過氧化物引發劑相容性極佳，能高效交聯不飽和烴並降低固化溫度；介電、耐熱及力學性能均獲顯著提升。具備低吸水、高活性、低黏度、高 Tg 等特性，可實現超低 Df，契合 M8 級別高速覆銅板（CCL）需求。
BVF ResinBVF 樹脂
New low-dielectric crosslinker新型低介電交聯劑
A new low-dielectric crosslinker offering lower dielectric loss and a lower coefficient of thermal expansion, together with a higher glass transition temperature. Dissolution behaviour is significantly improved, which raises formulation flexibility and simplifies processing. Suited to M8-class copper clad laminate applications.新型低介電交聯劑。具備更低的介電損耗與熱膨脹係數、更高的玻璃化轉變溫度；溶解性顯著改善，可提升配方靈活性並簡化加工工藝。適用於 M8 級別覆銅板應用。
DVB CopolymerDVB 共聚物
Multifunctional vinyl polyphenyl oligomer多功能乙烯基聚苯基低聚物
A multifunctional vinyl polyphenyl oligomer with high compatibility across unsaturated monomers such as styrenics, allylics, acrylates and maleimides. It combines low solution viscosity, excellent aromatic solubility and very low Df and CTE, making it suitable for M8-class and above copper clad laminate applications.多功能乙烯基聚苯基低聚物。與苯乙烯類、烯丙基類、丙烯酸類、馬來醯亞胺類等不飽和單體高度相容；具備低溶液黏度、優異芳烴溶解性、極低 Df 與 CTE，適用於 M8 級及以上覆銅板應用。
PPO (Polyphenylene Oxide) Resin聚苯醚 PPO 樹脂
Low-molecular-weight reactive PPO低分子量反應性聚苯醚
A low-molecular-weight reactive PPO resin. Different chemical end-capping options allow it to be matched to different formulation systems. It delivers ultra-low Dk/Df together with high Tg, high modulus, dimensional stability and excellent heat resistance, and maintains low water uptake under high temperature and high humidity. Well suited to the ultra-low-loss CCL requirements of 5G communications and AI accelerator cards, and compatible with prepreg and resin film processing.低分子量反應性聚苯醚樹脂。透過不同的化學封端設計，可適配各類配方體系；具備超低 Dk / Df、高 Tg、高模量、尺寸穩定與優異耐熱性，在高溫高濕環境下仍保持低吸水率。契合 5G 通信與 AI 加速卡對超低損耗 CCL 的要求，並與半固化片、樹脂膜工藝加工相容。
Other Additives其他助劑
Supporting additives for formulation配方配套助劑
Silane coupling agents, toughening agents, flame retardants, levelling agents and other supporting additives. Selected to match the customer's formulation system and process conditions, these additives help improve interfacial bonding, toughness, flame-retardant rating and coating levelling.矽烷偶聯劑、增韌劑、阻燃劑、流平劑等配套助劑。可依客戶配方體系與工藝條件選型供應，用於改善界面結合力、韌性、阻燃等級與塗佈流平性。